Ibaraki, Japan

Hikari Murai

USPTO Granted Patents = 36 


 

Average Co-Inventor Count = 4.5

ph-index = 3

Forward Citations = 35(Granted Patents)


Location History:

  • Shimodate, JP (1998 - 2001)
  • Yuki, JP (2009)
  • Chikusei, JP (2012 - 2013)
  • Ibaraki, JP (2013 - 2022)
  • Tokyo, JP (2017 - 2024)

Company Filing History:


Years Active: 1998-2024

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36 patents (USPTO):Explore Patents

Title: Hikari Murai: Innovations in Silicone Compounds and Thermosetting Resins

Introduction:

Hikari Murai is an accomplished inventor from Ibaraki, Japan, with a remarkable portfolio of 34 patents. He has contributed significantly to the field of materials science, particularly in the development of modified silicone compounds and thermosetting resin compositions. His cutting-edge inventions have found applications in various industries, including semiconductor packaging and electronic devices.

Latest Patents:

Among Hikari Murai's recent patents is a modified silicone compound that is prepared by reacting a siloxane diamine, a maleimide compound with N-substituted maleimide groups, and an amine compound with an acidic substituent. This compound has paved the way for the creation of thermosetting resin compositions, prepregs, laminate plates, and printed wiring boards. These innovative materials demonstrate exceptional properties such as high glass transition temperature, low coefficient of thermal expansion, improved copper foil adhesion, and enhanced resistance to hygroscopicity and heat.

Career Highlights:

Throughout his career, Murai has worked with renowned companies in the industry, including Hitachi Chemical Company, Ltd. and Showa Denko Materials Co., Ltd. During his tenure, he has consistently pushed the boundaries of materials science, focusing on improving the performance and reliability of electronic components.

Collaborations:

Hikari Murai has collaborated with esteemed professionals, such as Tomohiko Kotake and Masato Miyatake, to further advance his inventions. These collaborative efforts have not only expanded the depth of his research but also fostered a culture of innovation and knowledge exchange.

Conclusion:

Hikari Murai's contributions to the field of materials science, particularly in the development of modified silicone compounds and thermosetting resin compositions, have made a lasting impact. His inventions have opened doors to improved semiconductor packaging and electronic devices, offering enhanced performance, reliability, and durability. As Murai continues to explore new frontiers, his expertise will undoubtedly shape the future of materials innovation.

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