Hitachi Chemical Company, Ltd.

Showa Denko Materials Co., Ltd.

Resonac Corporation

Hikari Murai

Tomohiko Kotake

Masato Miyatake

Yasuyuki Mizuno

Shin Takanezawa

Hiroyuki Izumi

Tomio Fukuda

Daisuke Fujimoto

Shinji Tsuchikawa

Takao Tanigawa

Yuki Nagai

Shunsuke Nagai

Yasuo Inoue

Shintaro Hashimoto

Yasuo Kamigata

Yoshihiro Takahashi

Chisato Kikkawa

Masahiro Aoshima

Kazutoshi Danjobara

Aya Kasahara

Yoshihiro Nakamura

Yoshiyuki Takeda

Kouji Morita

Shinichiro Abe

Nozomu Takano

Ken Nanaumi

Nobuyuki Ogawa

Tetsurou Irino

Masanori Akiyama

Kazunaga Sakai

Yuka Yamazaki

Minoru Kakitani

Shinichi Kamoshida

Michitoshi Arata

Yuusuke Kondou

Yuichi Shimayama

Yasuyuki Hirai

Etsuo Mizushima

Teruki Aizawa

Yutaka Nomura

Norihiko Sakamoto

Norihiro Abe

Tetsuroh Irino

Kenichi Oohori

Syunichi Numata

Kunpei Yamada

Hirokuni Ogihara

Kazutoshi Danjoubara

Toshiyuki Iijima

Hiroshi Sakai

Yusuke Watase

Kumiko Ishikura

The present invention relates to an adhesive film for a multilayer printed-wiring board, in which a property of filling irregularities is excellent even when silica filler is highly filled. Specifically, there is provided an adhesive film for a multilayer printed-wiring board, which includes a resin composition layer that is obtained by forming a layer of a resin composition containing: (A) a novolac type phenolic resin in which a dispersity (Mw/Mn) of a weight average molecular weight (Mw) and a number average molecular weight (Mn) ranges from 1.05 to 1.8; (B) an epoxy resin represented by general formula (1); and (C) inorganic filler, on a support film. An average particle size of the (C) inorganic filler in the resin composition layer is 0.1 μm or more, and a content of the (C) inorganic filler in a resin solid content ranges from 20% to 95% by mass.

Adhesive film for multilayer printed-wiring board

A method for producing an aerogel composite includes drying a wet gel generated from a sol comprising a silica particles, and at least one selected from the group consisting of a silicon compound having a hydrolyzable functional group in a molecule, and a hydrolysis product of the silicon compound.

Aerogel composite, and supporting member and heat insulation material provided with aerogel composite

There are provided a modified silicone compound prepared by reacting: (A) a siloxane diamine represented by the general formula (1); (B) a maleimide compound with at least two N-substituted maleimide groups in the molecular structure; and (C) an amine compound with an acidic substituent; and also provided a thermosetting resin composition, a prepreg, a laminated plate, and a printed wiring board that are formed by using this compound. The multi-layered printed wiring board produced by using the laminated plate formed by using the prepreg obtained from the modified silicone compound and the thermosetting resin composition of the present invention through laminate molding has an excellent glass transition temperature, coefficient of thermal expansion, copper foil adhesion, hygroscopicity, hygroscopic solder heat resistance, and copper-stuck solder heat resistance. Therefore, the multi-layered printed wiring board is useful as a highly integrated semiconductor package and a printed wiring board for an electronic device. 

Modified silicone compound, and thermosetting resin composition, prepreg, laminate plate and printed wiring board using same

Provided are a thermosetting resin composition having especially good compatibility and having dielectric properties (low dielectric constant and low dielectric dissipation factor) in a high frequency range, high adhesion to conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy, and a prepreg, a laminate and a multilayer printed wiring board using the resin composition. Specifically, the thermosetting resin composition contains (A) a polyphenylene ether derivative having an N-substituted maleimide structure-containing group and a structural unit represented by the following general formula (I) in one molecule, (B) at least one thermosetting resin selected from the group consisting of epoxy resins, cyanate resins and maleimide compounds, and (C) a phosphorus flame retardant: wherein Reach independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and x represents an integer of 0 to 4.

Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board

A production method for an aerogel laminate includes a step of preparing a sol of producing a sol for forming an aerogel, an applying step of applying the sol obtained in the step of preparing a sol to a support having a heat ray reflective function or a heat ray absorbing function, and drying the sol to form an aerogel layer, an aging step of aging the aerogel layer obtained in the applying step, a washing step of washing the aged aerogel layer and performing solvent exchange, and a drying step of drying the aerogel layer washed in the washing step.

Aerogel laminate and thermal insulation material

The present invention relates to a resin composition containing a compound having a maleimido group, a divalent group having at least two imido bonds and a saturated or unsaturated divalent hydrocarbon group.

Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar

A sol composition for aerogel formation including a hydrolysis product of a polysiloxane compound.

Sol composition

An aerogel laminate roll is prepared by winding an aerogel laminate around a roll core, the aerogel laminate comprising a support and an aerogel layer disposed on the support and having a thickness of 200 &#x3bc;m or less.

Production method for aerogel laminate, and aerogel laminate roll

Provided are a resin composition having especially good compatibility and having dielectric properties (low dielectric constant and low dielectric dissipation factor) in a high frequency range, high adhesion to conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy, and a prepreg, a laminate and a multilayer printed wiring board using the resin composition. Specifically, the resin composition contains (A) a polyphenylene ether derivative having an N-substituted maleimide structure-containing group and a structural unit represented by the following general formula (I) in one molecule, (B) at least one thermosetting resin selected from the group consisting of epoxy resins, cyanate resins and maleimide compounds, and (C) a styrenic thermoplastic elastomer: 

Resin composition, prepreg, laminate and multilayer printed wiring board

The present invention pertains to an aerogel having a thermal conductivity of 0.03 W/m&#xb7;K or less and a compressive elasticity modulus of 2 MPa or less at 25&#xb0; C. under atmospheric pressure.

Aerogel

The invention relates to an aerogel composite comprising an aerogel component and a silica particle, and being superior in thermal insulation properties and flexibility.

The present invention relates to a production method for an aerogel laminate including a support, and an aerogel layer disposed on the support and having a thickness of 200 &#x3bc;m or less, the method comprising a step of washing a wet gel laminate including the support and a wet gel layer disposed on the support by a roll-to-roll scheme.

Provided is a thermosetting resin composition containing a polyimide compound (A) having a structural unit derived from a maleimide compound (a1) having at least two N-substituted maleimide groups and a structural unit derived from a diamine compound (a2); a modified polybutadiene (B); and an inorganic filler (C).

Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and method for producing same

Growing community of inventors

Ibaraki, Japan

Hikari Murai