The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2026
Filed:
Aug. 06, 2021
Resonac Corporation, Tokyo, JP;
Hiroyuki Izawa, Tokyo, JP;
Hikari Murai, Tokyo, JP;
Nozomu Takano, Tokyo, JP;
Kunihiko Akai, Tokyo, JP;
Yuka Itoh, Tokyo, JP;
Masashi Ohkoshi, Tokyo, JP;
RESONAC CORPORATION, Tokyo, JP;
Abstract
A method for manufacturing a substrate with built-in components includes providing an intermediate member including an electronic component with a first electrode provided on a first surface thereof, and a first electrically conductive layer provided on the first surface of the electronic component so as to cover the first electrode, and forming a first insulating resin layer on a first surface of the intermediate member. The first electrically conductive layer includes a first curable adhesive layer formed from a curable adhesive layer including electrically conductive particles and a cured adhesive composition, and a first metal foil layer disposed on the first curable adhesive layer that is a surface on a side opposite to the electronic component. The electrically conductive particles of the first curable adhesive layer electrically connect the first electrode of the electronic component and the first metal foil layer.