Tokyo, Japan

Yuka Itoh

This inventor holds 1 USPTO granted patent and 10 published patent applications. Top assignee: Resonac Corporation. Active years: 2026.

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Yuka Itoh - Innovator in Substrate Manufacturing Technology

Introduction

Yuka Itoh is a prominent inventor based in Tokyo, Japan. She has made significant contributions to the field of substrate manufacturing, particularly with her innovative methods that enhance the integration of electronic components.

Latest Patents

Yuka Itoh holds a patent for a "Method for manufacturing substrate with built-in components." This patent describes a process that involves providing an intermediate member that includes an electronic component with a first electrode on its surface. The method also includes forming a first insulating resin layer on the intermediate member. The first electrically conductive layer, which is crucial for the functionality of the substrate, consists of a curable adhesive layer containing electrically conductive particles and a metal foil layer. This innovative approach allows for efficient electrical connections between components, showcasing her expertise in the field.

Career Highlights

Yuka Itoh is currently employed at Resonac Corporation, where she continues to develop cutting-edge technologies in substrate manufacturing. Her work has been instrumental in advancing the capabilities of electronic devices, making them more efficient and reliable.

Collaborations

Yuka collaborates with her coworker, Hiroyuki Izawa, to further enhance their research and development efforts. Together, they contribute to the innovative projects at Resonac Corporation.

Conclusion

Yuka Itoh's contributions to substrate manufacturing technology highlight her role as a leading inventor in her field. Her innovative methods and collaborative efforts continue to push the boundaries of electronic component integration.

Profile summary based on public USPTO records.
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