The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2024
Filed:
Sep. 10, 2018
Applicant:
Showa Denko Materials Co., Ltd., Tokyo, JP;
Inventors:
Naoki Maruyama, Tokyo, JP;
Tomoko Higashiuchi, Tokyo, JP;
Kazumasa Fukuda, Tokyo, JP;
Hideyuki Katagi, Tokyo, JP;
Yuki Nakamura, Tokyo, JP;
Yoshitaka Takezawa, Tokyo, JP;
Assignee:
SHOWA DENKO MATERIALS CO., LTD., Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08G 59/24 (2006.01); C08G 59/50 (2006.01); C08G 59/56 (2006.01); C08G 59/62 (2006.01); C08G 59/68 (2006.01); C08J 5/04 (2006.01);
U.S. Cl.
CPC ...
C08G 59/245 (2013.01); C08G 59/504 (2013.01); C08G 59/56 (2013.01); C08G 59/621 (2013.01); C08G 59/688 (2013.01); C08J 5/042 (2013.01); C08J 2363/02 (2013.01);
Abstract
An epoxy resin includes an epoxy compound having a mesogenic structure, a cured product of the epoxy resin having a flexural modulus of 3.0 GPa or more at 23° C., a fracture toughness of 1.0 MPa·mor more, and a glass transition temperature of 150° C. or higher.