The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2024
Filed:
Jun. 23, 2021
Applicant:
Showa Denko Materials Co., Ltd., Tokyo, JP;
Inventors:
Masaya Toba, Tokyo, JP;
Kazuyuki Mitsukura, Tokyo, JP;
Assignee:
RESONAC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/38 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H05K 1/09 (2006.01); H05K 3/18 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/381 (2013.01); H01L 21/486 (2013.01); H01L 23/49838 (2013.01); H05K 1/09 (2013.01); H05K 3/18 (2013.01); H05K 3/4644 (2013.01); H05K 2201/032 (2013.01); H05K 2203/0723 (2013.01);
Abstract
Disclosed is a method for manufacturing a wiring structure including a step of forming a wiring on an insulating resin layer. The step of forming the wiring includes: forming a modified region including pores in a surface layer of the insulating resin layer by treating a surface of the insulating resin layer with a treatment method including surface modification; forming a seed layer on the surface of the insulating resin layer by sputtering; and forming the wiring on the seed layer by electrolytic copper plating.