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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10756008 B1

PDFFull Text
Date of Patent:
Aug. 25, 2020

Filed:

Feb. 23, 2017

Organic interposer and method for manufacturing organic interposer

Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Kazuyuki Mitsukura, Tokyo, JP;

Masaya Toba, Tokyo, JP;

Yoshinori Ejiri, Tokyo, JP;

Kazuhiko Kurafuchi, Tokyo, JP;

Assignee:

HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;

Attorney:

Fitch, Even, Tabin & Flannery, L.L.P.

Primary Examiner:

Roshn K Varghese

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/14 (2006.01); H01L 23/32 (2006.01); H01L 23/538 (2006.01); H01L 23/12 (2006.01); H01L 21/48 (2006.01); H05K 1/09 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 21/4857 (2013.01); H01L 23/12 (2013.01); H01L 23/145 (2013.01); H01L 23/32 (2013.01); H01L 23/49866 (2013.01); H01L 23/49894 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 25/0652 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06572 (2013.01); H05K 1/09 (2013.01);
Abstract

There are provided an organic interposer capable of improving insulation reliability and a method for manufacturing the organic interposer. An organic interposeris provided with: an organic insulating laminatecomprising a plurality of organic insulating layers; and a plurality of wiresarranged in the organic insulating laminate, and each of the wiresand each of the organic insulating layers are separated by a barrier metal film. The organic insulating laminatemay include: a first organic insulating layerhaving a plurality of grooveseach having each of the wiresdisposed therein; and a second organic insulating layerlaminated to the first organic insulating layerin such a way as to embed the wires

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