The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2020
Filed:
Sep. 26, 2017
Applicant:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Inventors:
Shinichiro Abe, Tokyo, JP;
Kazuhiko Kurafuchi, Tokyo, JP;
Tomonori Minegishi, Tokyo, JP;
Kazuyuki Mitsukura, Tokyo, JP;
Masaya Toba, Tokyo, JP;
Assignee:
HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); C08L 79/08 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H05K 3/46 (2006.01); C08K 3/013 (2018.01);
U.S. Cl.
CPC ...
H05K 1/0373 (2013.01); C08L 79/08 (2013.01); H01L 23/49811 (2013.01); H01L 23/49822 (2013.01); H01L 23/5383 (2013.01); H05K 3/4655 (2013.01); C08K 3/013 (2018.01); C08L 2203/202 (2013.01);
Abstract
One aspect of the present invention relates to a resin composition comprising a curable resin and a curing agent, which is used for forming an inter-wiring layer insulating layer in contact with a copper wiring.