Takasaki, Japan

Kazunori Hagimoto

This inventor holds 17 USPTO granted patents and 28 published patent applications and 1 EPO patent, primarily in Semiconductor Manufacturing. Top assignees: Shin-Etsu Handotai Co., Ltd., Sanken Electric Co., Ltd., Nanoteco Corporation. Active years: 2006-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kazunori Hagimoto. Retrieved from https://idiyas.com/inventor/kazunori-hagimoto

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 17 

% Patents Active = 100.0

 

Average Co-Inventor Count = 5.1

ph-index = 4

Forward Citations = 49(Granted Patents)


Location History:

  • Annaka, JP (2006)
  • Takasaki, JP (2016 - 2023)

Company Filing History:


Years Active: 2006-2025

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Areas of Expertise:
Epitaxial Wafer
Silicon-Based Substrate
Semiconductor Device
Buffer Layer
Electronic Device
Manufacturing Method
Light-Emitting Device
Boron Containing Layer
Graded Buffer Layer
Device Fabrication
Substrate Production
17 patents (USPTO):Explore Patents

Title: Innovations by Kazunori Hagimoto in Semiconductor Technology

Introduction

Kazunori Hagimoto, an esteemed inventor based in Takasaki, Japan, has made significant contributions to the field of semiconductor technology through his innovative designs and methodologies. With 16 patents to his name, he has been instrumental in developing cutting-edge solutions for electronic devices.

Latest Patents

Hagimoto's recent inventions include a substrate for electronic devices and a method for producing the same. This substrate features a nitride semiconductor film formed on a silicon single crystal joining multiple substrates with a thickness exceeding 2000 µm. His innovation effectively suppresses warp and enhances the performance of products with high breakdown voltage.

Another noteworthy patent from Hagimoto is the semiconductor device substrate, which includes a buffer layer made of a nitride semiconductor. This sophisticated design incorporates regions with varying concentrations of carbon and iron to minimize transverse leak current in high-temperature device operations, as well as longitudinal leak currents, providing an effective solution to mitigate current collapse phenomena.

Career Highlights

Hagimoto has previously worked with prominent companies such as Shin-Etsu Handotai Co., Ltd. and Sanken Electric Co., Ltd., where he refined his skills and expertise in semiconductor technologies.

Collaborations

Throughout his career, Hagimoto has collaborated with notable coworkers, including Masaru Shinomiya and Keitaro Tsuchiya. These partnerships have contributed to his success and the advancement of semiconductor innovations.

Conclusion

Kazunori Hagimoto's innovative approaches in semiconductor technology, exemplified by his recent patents, showcase his substantial impact on the industry. His dedication to improving electronic device substrates paves the way for enhanced performance and reliability in the field, establishing him as a key player in semiconductor invention and development.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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