Joyce C Liu

USPTO Granted Patents = 23 (Patent Applications = 4)

Average Co-Inventor Count = 5.0

ph-index = 7

Forward Citations = 197(Granted Patents)

Location History:

Hopewell Junction, NY (US) (2001 - 2004)
Carmel, NY (US) (2004 - 2019)

Company Filing History:

17 out of 164,108

International Business Machines Corporation

1 out of 832,680

Other

patents

Years Active: 2001-2019

where 'Filed Patents' based on already Granted Patents

23 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 10446484 - Through-silicon via with improved substrate contact for reduced through-silicon via (TSV) capacitance variability (2019-10-15),

2. 10095115 - Forming edge etch protection using dual layer of positive-negative tone resists (2018-10-09),

3. 9847290 - Through-silicon via with improved substrate contact for reduced through-silicon via (TSV) capacitance variability (2017-12-19),

4. 9728506 - Strain engineering devices using partial depth films in through-substrate vias (2017-08-08),

5. 9252133 - Electrical leakage reduction in stacked integrated circuits having through-silicon-via (TSV) structures (2016-02-02),

6. 8907494 - Electrical leakage reduction in stacked integrated circuits having through-silicon-via (TSV) structures (2014-12-09),

7. 7858485 - Structure and method for manufacturing trench capacitance (2010-12-28),

8. 7081393 - Reduced dielectric constant spacer materials integration for high speed logic gates (2006-07-25),

9. 6838347 - Method for reducing line edge roughness of oxide material using chemical oxide removal (2005-01-04),

10. 6828187 - Method for uniform reactive ion etching of dual pre-doped polysilicon regions (2004-12-07),

11. 6821890 - Method for improving adhesion to copper (2004-11-23),

12. 6727589 - Dual damascene flowable oxide insulation structure and metallic barrier (2004-04-27),

13. 6720249 - Protective hardmask for producing interconnect structures (2004-04-13),

14. 6703312 - Method of forming active devices of different gatelengths using lithographic printed gate images of same length (2004-03-09),

15. 6518151 - Dual layer hard mask for eDRAM gate etch process (2003-02-11),

Title: Innovations and Patents of Joyce C Liu

Introduction

Joyce C Liu is a notable inventor based in Carmel, NY, with a remarkable portfolio of 23 patents. His work primarily focuses on advancing semiconductor technologies, demonstrating significant contributions to the field through innovative methods and structures.

Latest Patents

Some of Liu's recent patents include:

1. **Through-silicon via with improved substrate contact for reduced through-silicon via (TSV) capacitance variability**. This patent describes a semiconductor structure that enhances TSV performance by improving substrate contact. The design incorporates a substrate of a first species type with a second species type adjacent to a through substrate via, aimed at reducing capacitance variability.

2. **Forming edge etch protection using dual layers of positive-negative tone resists**. This patent outlines methods for creating edge etch protection on a wafer substrate, utilizing dual layers of positive and negative tone resists. The process involves depositing and curing different types of resists to effectively protect the wafer edges during manufacturing.

Career Highlights

Liu has made significant strides in his career, taking roles at prestigious institutions such as IBM and Globalfoundries Inc. His experiences at these companies have allowed him to refine his expertise in semiconductor technologies and contribute to high-impact innovations in the industry.

Collaborations

Throughout his career, Liu has collaborated with several distinguished colleagues, including Vincent James McGahay and Rebecca D Mih. These partnerships have facilitated the sharing of knowledge and expertise, leading to the development of pioneering technologies.

Conclusion

Joyce C Liu’s contributions to semiconductor innovation are marked by his inventive spirit and dedication to improving technologies. With 23 patents to his name, he continues to play a vital role in advancing the semiconductor industry, shaping the future of electronic devices and systems.

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4 patents pending:

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