logo

For the Inventor, By the Inventor

Kiel, Germany

Jacek Rudzki

This inventor holds 14 USPTO granted patents and 3 published patent applications. Top assignees: Danfoss Silicon Power Gmbh, Heraeus Deutschland Gmbh & Co Kg. Active years: 2016-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jacek Rudzki. Retrieved from https://idiyas.com/inventor/jacek-rudzki

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 14 

% Patents Active = 100.0

Average Co-Inventor Count = 5.1

ph-index = 2

Forward Citations = 8(Granted Patents)


Location History:

  • Nordborg, DK (2020)
  • Kiel, DE (2016 - 2022)

Company Filing History:

goldMedal13 out of 54 
 
Danfoss Silicon Power Gmbh
 patents
silverMedal1 out of 201 
 
Heraeus Deutschland Gmbh & Co Kg
 patents

Years Active: 2016-2026

Loading Chart...
14 patents (USPTO):Explore Patents
1. 12581983 - Semiconductor module comprising a semiconductor and comprising a shaped metal body that is electrically contacted by the semiconductor (2026-03-17),
2. 12125817 - Semiconductor module with a first substrate, a second substrate and a spacer separating the substrates from each other (2024-10-22),
3. 11400514 - Sintering tool and method for sintering an electronic subassembly (2022-08-02),
4. 10818633 - Sintering tool for the lower die of a sintering device (2020-10-27),
5. 10814396 - Sintering tool and method for sintering an electronic subassembly (2020-10-27),
6. 10622331 - Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic component (2020-04-14),
7. 10607962 - Method for manufacturing semiconductor chips (2020-03-31),
8. 10483229 - Sintering device (2019-11-19),
9. 10438924 - Method for cohesively connecting a first component of a power semiconductor module to a second component of a power semiconductor module (2019-10-08),
10. 10332858 - Electronic sandwich structure with two parts joined together by means of a sintering layer (2019-06-25),
11. 10079219 - Power semiconductor contact structure and method for the production thereof (2018-09-18),
12. 9786627 - Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips (2017-10-10),
13. 9613929 - Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof (2017-04-04),
14. 9318421 - Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof (2016-04-19),

Title: Jacek Rudzki: Innovator in Semiconductor Technology

Introduction

Jacek Rudzki is a prominent inventor based in Kiel, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of 13 patents. His innovative work has had a considerable impact on the industry, showcasing his expertise and creativity.

Latest Patents

Among his latest patents is a semiconductor module that features a first substrate, a second substrate, and a spacer that separates the substrates from each other. This module is designed to enhance the performance and reliability of semiconductor devices. Another notable patent is a sintering tool and method for sintering an electronic subassembly. This tool includes a cradle for receiving the electronic subassembly and is characterized by support brackets that fix a protective film covering the assembly.

Career Highlights

Jacek Rudzki has worked with several reputable companies throughout his career. Notably, he has been associated with Danfoss Silicon Power GmbH and Heraeus Deutschland GmbH & Co. KG. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

Some of Jacek's coworkers include Frank Osterwald and Martin Becker. Their collaboration has contributed to the advancement of various projects and innovations in the field.

Conclusion

Jacek Rudzki is a distinguished inventor whose work in semiconductor technology has led to numerous patents and advancements in the industry. His contributions continue to influence the field and inspire future innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…