The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2026

Filed:

Apr. 30, 2020
Applicant:

Danfoss Silicon Power Gmbh, Flensburg, DE;

Inventors:

André Bastos Abibe, Flensburg, DE;

Frank Osterwald, Flensburg, DE;

Jacek Rudzki, Flensburg, DE;

Martin Becker, Flensburg, DE;

Ronald Eisele, Flensburg, DE;

David Benning, Flensburg, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/40 (2013.01); H01L 24/32 (2013.01); H01L 24/37 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/84 (2013.01); H01L 24/85 (2013.01); H01L 2224/32058 (2013.01); H01L 2224/32059 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/37124 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/4001 (2013.01); H01L 2224/4007 (2013.01); H01L 2224/40091 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/48011 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/73213 (2013.01); H01L 2224/73221 (2013.01); H01L 2224/8382 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/84205 (2013.01); H01L 2224/84207 (2013.01); H01L 2224/85203 (2013.01); H01L 2224/8582 (2013.01); H01L 2224/8584 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/30107 (2013.01);
Abstract

Semiconductor module including a semiconductor and including a shaped metal body that is electrically contacted by the semiconductor, for forming a contact surface for an electrical conductor, wherein the shaped metal body is bent or folded. A method is also described for establishing electrical contacting of an electrical conductor on a semiconductor, said method including the steps of: fastening a bent or folded shaped metal body of a constant thickness to the semiconductor by means of a first fastening method and then fastening the electrical conductor to the shaped metal body by means of a second fastening method.


Find Patent Forward Citations

Loading…