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For the Inventor, By the Inventor

Flensburg, Germany

Danfoss Silicon Power Gmbh


USPTO Granted Patents = 54

% Expired Patents = 13.0


Trademarks = 6

Forward Citations = 214

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46 inventors (with patents filed for the assignee):

goldMedal Ronald Eisele (31 out of 33 patents)

silverMedal Frank Osterwald (17 out of 18 patents)

bronzeMedal Martin Becker (14 out of 15 patents)

4.  Jacek Rudzki (13 out of 14 patents)

5.  Klaus Kristen Olesen (11 out of 11 patents)

6.  Lars Paulsen (10 out of 16 patents)

7.  Holger Ulrich (9 out of 10 patents)

8.  Ole Mühlfeld (5 out of 5 patents)

9.  Mathias Kock (5 out of 5 patents)

10.  Henning Ströbel-Maier (3 out of 3 patents)

11.  Holger Beer (3 out of 3 patents)

12.  Klaus Olesen (3 out of 3 patents)

13.  Alvaro Jorge Mari Curbelo (2 out of 35 patents)

14.  Georg Wecker (2 out of 2 patents)

15.  Christopher Klaehr (2 out of 2 patents)


Core Competencies:
Pressure-Sintering
Cooling System
Power Module
Semiconductor Module
Electronic Component
Sintering Tool
High-Voltage Applications
Busbar
Thermal Management
Cooling Device
Modular Design
Electronic Power System

54 patents:

1. 12654223 - Pressure-sintering method employing deformation uptake means (2026-06-16),
2. 12635522 - Electronic component cooler (2026-05-19),
3. 12627290 - Switching components (2026-05-12),
4. 12621969 - Electronic power system and method for manufacturing the same (2026-05-05),
5. 12620907 - Conductor structure (2026-05-05),
6. 12581983 - Semiconductor module comprising a semiconductor and comprising a shaped metal body that is electrically contacted by the semiconductor (2026-03-17),
7. 12444670 - Power module (2025-10-14),
8. 12424512 - Cooling system comprising a serpentine passageway (2025-09-23),
9. 12261543 - Three-level power module (2025-03-25),
10. 12136585 - Compact power electronics module with increased cooling surface (2024-11-05),
11. 12133366 - Power electronics module with improved cooling (2024-10-29),
12. 12125817 - Semiconductor module with a first substrate, a second substrate and a spacer separating the substrates from each other (2024-10-22),
13. 12087699 - Semiconductor module (2024-09-10),
14. 12046584 - Semiconductor module (2024-07-23),
15. 12046576 - Pressure sintering device and method for manufacturing an electronic component (2024-07-23),
Danfoss Silicon Power GmbH, located in Flensburg, Germany, specializes in the development and manufacturing of advanced power semiconductor modules. The company focuses on core technologies such as pressure-sintering and innovative cooling systems, catering to high-voltage applications. Their expertise extends to electronic components and sintering tools, positioning them as a key player in the semiconductor industry. Danfoss Silicon Power is dedicated to enhancing the efficiency and reliability of power electronics across various sectors.
Profile summary based on public USPTO records.

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USPTO Data Jan 1 1976 - Oct 6 2026

Danfoss Silicon Power Gmbh
54 Patents

#1 in Flensburg

#987 in Germany

#13,109 in the World

Flensburg, DE
Flensburg, Germany

Danfoss Silicon Power Gmbh

Forward Citations = 214

46 inventors:

goldMedal Ronald Eisele (31 out of 33 patents)

silverMedal Frank Osterwald (17 out of 18 patents)

bronzeMedal Martin Becker (14 out of 15 patents)

4.  Jacek Rudzki (13 out of 14 patents)

5.  Klaus Kristen Olesen (11 out of 11 patents)

Please report any incorrect information to [email protected]
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