The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2024
Filed:
Apr. 30, 2020
Danfoss Silicon Power Gmbh, Flensburg, DE;
Stefan Behrendt, Kiel, DE;
Ronald Eisele, Surendorf, DE;
DANFOSS SILICON POWER GMBH, Flensburg, DE;
Abstract
The invention relates to a power electronics module including a first circuit carrier (), as well as an electronic assembly () arranged in an electrically contacting manner on the upper flat side of the first circuit carrier (), and a first cooling element () in thermal contact with the underside of the first circuit carrier (), wherein the module has at least one second assembly () arranged on the upper side of a second circuit carrier () and a second cooling element () arranged on the underside of the second circuit carrier (), wherein the first and the second circuit carriers () are arranged with their upper sides facing one another and at least one central heat sink () that is electrically insulated from the assemblies () is arranged in the space between the assemblies (), wherein the assemblies () and the at least one central heat sink () are embedded in a heat-conducting potting compound (), wherein the module has a number N≥3 of circuit carriers () with assemblies () mounted on their upper sides and cooling elements () mounted on their undersides, and the sides having the assemblies () and directed towards one another are arranged around the central heat sink () forming a shape with an N-sided polygon as across-section.