The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2024
Filed:
May. 06, 2020
Applicant:
Danfoss Silicon Power Gmbh, Flensburg, DE;
Inventors:
Martin Becker, Flensburg, DE;
André Bastos Abibe, Flensburg, DE;
Ronald Eisele, Flensburg, DE;
Jacek Rudzki, Flensburg, DE;
Frank Osterwald, Flensburg, DE;
David Benning, Flensburg, DE;
Assignee:
DANFOSS SILICON POWER GMBH, Flensburg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/40 (2013.01); H01L 23/49833 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/84 (2013.01); H01L 24/85 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/4001 (2013.01); H01L 2224/40091 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/40225 (2013.01); H01L 2224/48011 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/73213 (2013.01); H01L 2224/73221 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/8484 (2013.01); H01L 2224/85203 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/351 (2013.01); H01L 2924/37001 (2013.01);
Abstract
Semiconductor module having a first substrate, a second substrate and a spacer distancing the substrates from each other, wherein the spacer is formed by at least one elastic shaped metal body.
Becker, Martin. (2024). Semiconductor module with a first substrate, a second substrate and a spacer separating the substrates from each other (U.S. Patent No. 12125817). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12125817
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile