The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2024

Filed:

Apr. 30, 2020
Applicant:

Danfoss Silicon Power Gmbh, Flensburg, DE;

Inventors:

Stefan Behrendt, Kiel, DE;

Ronald Eisele, Surendorf, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/205 (2013.01); H05K 7/209 (2013.01);
Abstract

The invention relates to a power electronics module including a flat circuit carrier () and an electronic assembly () arranged in an electrically contacting manner on the upper flat side of the circuit carrier () and cooling bodies () thermally in contact with the underside of the circuit carrier (), wherein a heat-conducting bridge () arranged on the upper side of the circuit carrier (), spanning the assembly () and extensively covering same, wherein the heat-conducting bridge () is in thermal contact with the cooling body () at mounting points arranged next to the assembly () and the space between the heat-conducting bridge () and the circuit carrier () is filled with a heat-conducting potting compound ().


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