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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10622331 B1

PDFFull Text
Date of Patent:
Apr. 14, 2020

Filed:

Sep. 28, 2016

Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic component

Applicant:

Heraeus Deutschland Gmbh & Co. KG, Hanau, DE;

Inventors:

Andreas Hinrich, Freigericht, DE;

Susanne Duch, Bruchköbel, DE;

Anton Miric, Alzenau, DE;

Michael Schäfer, Künzell, DE;

Christian Bachmann, Nordborg, DK;

Holger Ulrich, Nordborg, DK;

Frank Osterwald, Nordborg, DK;

David Benning, Nordborg, DK;

Jacek Rudzki, Nordborg, DK;

Lars Paulsen, Nordborg, DK;

Frank Schefuss, Nordborg, DK;

Martin Becker, Nordborg, DK;

Assignee:

Heraeus Deutschland GmbH & Co. KG, Hanau, DE;

Attorney:

Dicke, Billig & Czaja, PLLC

Primary Examiner:

Daniel P Shook

Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/14 (2006.01); H01L 23/373 (2006.01); H01L 23/495 (2006.01); H01L 21/683 (2006.01); H05K 3/34 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); H01L 21/4821 (2013.01); H01L 21/4867 (2013.01); H01L 21/4871 (2013.01); H01L 21/6836 (2013.01); H01L 23/142 (2013.01); H01L 23/3735 (2013.01); H01L 23/49582 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/95 (2013.01); H05K 3/3436 (2013.01); H01L 24/75 (2013.01); H01L 24/97 (2013.01); H01L 2221/68331 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/2731 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/2744 (2013.01); H01L 2224/27312 (2013.01); H01L 2224/27318 (2013.01); H01L 2224/27334 (2013.01); H01L 2224/27418 (2013.01); H01L 2224/27848 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/753 (2013.01); H01L 2224/75272 (2013.01); H01L 2224/83002 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/83898 (2013.01); H01L 2224/83907 (2013.01); H01L 2224/83986 (2013.01); H01L 2224/95 (2013.01); H01L 2224/97 (2013.01); H05K 3/305 (2013.01); Y02P 70/613 (2015.11);
Abstract

One aspect relates to a method for manufacturing a substrate assembly for attachment to an electronic component A substrate is provided with a first side and a second side. A contact material layer is applied to the first side of the substrate. A pre-fixing agent is applied at least to sections of a side of the contact material layer facing away from the substrate.

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