The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2020
Filed:
Sep. 09, 2015
Applicant:
Danfoss Silicon Power Gmbh, Flensburg, DE;
Inventors:
Frank Osterwald, Kiel, DE;
Ronald Eisele, Surendorf, DE;
Martin Becker, Kiel, DE;
Jacek Rudzki, Kiel, DE;
Lars Paulsen, Hollingstedt, DE;
Holger Ulrich, Eisendorf, DE;
Assignee:
Danfoss Silicon Power GmbH, Flensburg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 37/00 (2006.01); H01L 23/00 (2006.01); B23K 37/04 (2006.01); B22F 3/00 (2006.01); B22F 3/14 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); B22F 3/003 (2013.01); B22F 3/14 (2013.01); B23K 37/0408 (2013.01); B23K 37/0426 (2013.01); H01L 24/83 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75985 (2013.01); H01L 2224/75988 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83203 (2013.01); H01L 2924/00014 (2013.01);
Abstract
Tool () for the lower die of a sintering device, the tool () having a rest () for an electronic subassembly () comprising a circuit carrier, to be sintered, where the rest () is formed from a material with a coefficient of linear expansion that is close to the coefficient of expansion of the circuit carrier of the electronic subassembly ().