The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2020
Filed:
Jul. 26, 2016
Danfoss Silicon Power Gmbh, Flensburg, DE;
Frank Osterwald, Kiel, DE;
Martin Becker, Kiel, DE;
Holger Ulrich, Eisendorf, DE;
Ronald Eisele, Surendorf, DE;
Jacek Rudzki, Kiel, DE;
DANFOSS SILICON POWER GMBH, Flensburg, DE;
Abstract
A method for manufacturing semiconductor chips () having arranged thereon metallic shaped bodies (), having the following steps: arranging a plurality of metallic shaped bodies () on a processed semiconductor wafer while forming a layer arranged between the semiconductor wafer and the metallic shaped bodies (), exhibiting a first connection material () and a second connection material (), and processing the first connection material () for connecting the metallic shaped bodies () to the semiconductor wafer without processing the second connecting material (), wherein the semiconductor chips () are separated either prior to arranging the metallic shaped bodies () on the semiconductor wafer or after processing the first connection material ().