The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2017
Filed:
Sep. 10, 2012
Martin Becker, Kiel, DE;
Ronald Eisele, Surendorf, DE;
Frank Osterwald, Kiel, DE;
Jacek Rudzki, Kiel, DE;
Martin Becker, Kiel, DE;
Ronald Eisele, Surendorf, DE;
Frank Osterwald, Kiel, DE;
Jacek Rudzki, Kiel, DE;
Danfoss Silicon Power GmbH, Flensburg, DE;
Abstract
The invention relates to a method for connecting a power semi-conductor chip having upper-sided potential surfaces to thick wires or strips, consisting of the following steps: Providing a metal molded body corresponding to the shape of the upper-sided potential surfaces, applying a connecting layer to the upper-sided potential surfaces or to the metal molded bodies, and applying the metal molded bodies and adding a material fit, electrically conductive compound to the potential surfaces prior to the joining of the thick wire bonds to the non-added upper side of the molded body.