The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

Sep. 09, 2015
Applicant:

Danfoss Silicon Power Gmbh, Flensburg, DE;

Inventors:

Frank Osterwald, Kiel, DE;

Ronald Eisele, Surendorf, DE;

Martin Becker, Kiel, DE;

Lars Paulsen, Hollingstedt, DE;

Jacek Rudzki, Kiel, DE;

Holger Ulrich, Eisendorf, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B22F 3/14 (2006.01); B22F 5/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); B22F 3/14 (2013.01); B22F 5/00 (2013.01); H01L 24/83 (2013.01); B22F 2998/10 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/7531 (2013.01); H01L 2224/7532 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75251 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75315 (2013.01); H01L 2224/75316 (2013.01); H01L 2224/75317 (2013.01); H01L 2224/75318 (2013.01); H01L 2224/75704 (2013.01); H01L 2224/75821 (2013.01); H01L 2224/75824 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83209 (2013.01);
Abstract

Sintering device for sintering at least one electronic assembly, having a lower die and an upper die which is slidable towards the lower die, or a lower die which is slidable towards the upper die. The lower die forms a support for the assembly to be sintered and the upper die includes a receptacle for a pressure pad for exerting pressure directed towards the lower die, and a delimitation wall which laterally surrounds the pressure pad. The delimitation wall having an outer delimitation wall and an inner delimitation wall surrounded by the outer delimitation wall, the inner delimitation wall mounted so as to be slidable towards the outer delimitation wall and so as to be slid in the direction of the lower die such that, following the placing of the inner delimitation wall on the lower die, the pressure pad is displaceable in the direction of the lower die.


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