The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2017
Filed:
Apr. 11, 2016
Danfoss Silicon Power Gmbh, Flensburg, DE;
Martin Becker, Kiel, DE;
Ronald Eisele, Surendorf, DE;
Frank Osterwald, Kiel, DE;
Jacek Rudzki, Kiel, DE;
Danfoss Silicon Power GmbH, Flensburg, DE;
Abstract
The invention relates to a power semiconductor chip () having at least one upper-sided potential surface and contacting thick wires () or strips, comprising a connecting layer (I) on the potential surfaces, and at least one metal molded body () on the connecting layer(s), the lower flat side thereof facing the potential surface being provided with a coating to be applied to the connecting layer (I) according to a connection method, and the material composition thereof and the thickness of the related thick wires () or strips arranged on the upper side of the molded body used according to the method for contacting are selected corresponding to the magnitude.