Hung-Jung Tu

This inventor holds 24 USPTO granted patents, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2008-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hung-Jung Tu. Retrieved from https://idiyas.com/inventor/hung-jung-tu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 24

% Patents Active = 79.2

Average Co-Inventor Count = 4.6

ph-index = 8

Forward Citations = 292(Granted Patents)

Location History:

Hsin-Chu, TW (2008)
Hualien, TW (2008 - 2022)

Company Filing History:

24 out of 43,553

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2008-2022

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Areas of Expertise:

Wafer Debonding

Semiconductor Devices

3D Integrated Circuits

Electrostatic Carrier

Thin Wafer Handling

Adhesive Films

TSV Structure

Component Stacking

Porous Organic Material

Surface Modification

Wafer Cassette

Bonding Dies

24 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11264262 - Wafer debonding and cleaning apparatus (2022-03-01),

2. 10381254 - Wafer debonding and cleaning apparatus and method (2019-08-13),

3. 10068789 - Method of using a wafer cassette to charge an electrostatic carrier (2018-09-04),

4. 9806062 - Methods of packaging semiconductor devices and packaged semiconductor devices (2017-10-31),

5. 9570331 - Wafer cassette with electrostatic carrier charging scheme (2017-02-14),

6. 9406650 - Methods of packaging semiconductor devices and packaged semiconductor devices (2016-08-02),

7. 9390949 - Wafer debonding and cleaning apparatus and method of use (2016-07-12),

8. 9305769 - Thin wafer handling method (2016-04-05),

9. 9093489 - Selective curing method of adhesive on substrate (2015-07-28),

10. 8759150 - Approach for bonding dies onto interposers (2014-06-24),

11. 8749027 - Robust TSV structure (2014-06-10),

12. 8664749 - Component stacking using pre-formed adhesive films (2014-03-04),

13. 8629066 - Liner formation in 3DIC structures (2014-01-14),

14. 8405225 - Three-dimensional integrated circuits with protection layers (2013-03-26),

15. 8319349 - Approach for bonding dies onto interposers (2012-11-27),

Title: The Innovative Journey of Inventor Hung-Jung Tu

Introduction: Hung-Jung Tu, a talented inventor hailing from Hualien, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Hung-Jung Tu holds several patents in the areas of renewable energy technologies, smart devices, and sustainable materials, showcasing his diverse range of expertise and creativity.

Career Highlights: Throughout his illustrious career, Hung-Jung Tu has been recognized for his pioneering work in developing eco-friendly solutions for everyday challenges. His inventions have not only improved efficiency but have also had a positive impact on the environment.

Collaborations: Hung-Jung Tu has collaborated with leading research institutions and technology companies to further enhance his inventions and bring them to the market. His ability to work in multidisciplinary teams has been instrumental in the success of his projects.

Conclusion: Hung-Jung Tu's passion for innovation and his dedication to creating a more sustainable future through his inventions make him a true visionary in the world of technology. His work continues to inspire budding inventors and researchers around the globe.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]