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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9406650 B1

PDFFull Text
Date of Patent:
Aug. 02, 2016

Filed:

Apr. 21, 2014

Methods of packaging semiconductor devices and packaged semiconductor devices

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Shin-Puu Jeng, Hsin-Chu, TW;

Wen-Chih Chiou, Zhunan Township, TW;

Tu-Hao Yu, Hsin-Chu, TW;

Hung-Jung Tu, Hualien, TW;

Yu-Liang Lin, Hsin-Chu, TW;

Shih-Hui Wang, Zhonghe, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Ngan Ngo

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 24/89 (2013.01); H01L 25/50 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/08235 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/80805 (2013.01); H01L 2224/81805 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/0496 (2013.01); H01L 2924/04941 (2013.01); H01L 2924/04953 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/151 (2013.01); H01L 2924/161 (2013.01); H01L 2924/181 (2013.01);
Abstract

Methods of packaging semiconductor devices and packaged semiconductor devices are disclosed. In some embodiments, a method of packaging semiconductor devices includes coupling integrated circuit dies to a substrate, and disposing a molding material around the integrated circuit dies. A cap layer is disposed over the molding material and the plurality of integrated circuit dies.

Find Patent Forward Citations

Jeng, Shin-Puu. (2016). Methods of packaging semiconductor devices and packaged semiconductor devices (U.S. Patent No. 9406650). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9406650

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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