Yu-Liang Lin

This inventor holds 30 USPTO granted patents, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2000-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yu-Liang Lin. Retrieved from https://idiyas.com/inventor/yu-liang-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 30

% Patents Active = 50.0

Average Co-Inventor Count = 3.0

ph-index = 5

Forward Citations = 64(Granted Patents)

Location History:

Shin-Chu, TW (2002)
Hsin-Chu, TW (2000 - 2022)

Company Filing History:

30 out of 42,810

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2000-2022

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Areas of Expertise:

Wafer Debonding

Semiconductor Devices

Surface Modification

Polishing Apparatus

Electrostatic Carrier

Thin Wafer Cleaning

Adhesive Curing

Micro-Etching

Process Control

CO2 System

Damping Systems

Conditioning Disks

30 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11264262 - Wafer debonding and cleaning apparatus (2022-03-01),

2. 10381254 - Wafer debonding and cleaning apparatus and method (2019-08-13),

3. 10068789 - Method of using a wafer cassette to charge an electrostatic carrier (2018-09-04),

4. 9978628 - Bonding method including adjusting surface contours of a bonding system (2018-05-22),

5. 9806062 - Methods of packaging semiconductor devices and packaged semiconductor devices (2017-10-31),

6. 9570331 - Wafer cassette with electrostatic carrier charging scheme (2017-02-14),

7. 9406650 - Methods of packaging semiconductor devices and packaged semiconductor devices (2016-08-02),

8. 9390949 - Wafer debonding and cleaning apparatus and method of use (2016-07-12),

9. 9299594 - Substrate bonding system and method of modifying the same (2016-03-29),

10. 9153462 - Spin chuck for thin wafer cleaning (2015-10-06),

11. 9093489 - Selective curing method of adhesive on substrate (2015-07-28),

12. 8722540 - Controlling defects in thin wafer handling (2014-05-13),

13. 8133097 - Polishing apparatus (2012-03-13),

14. 7905109 - Rapid cooling system for RTP chamber (2011-03-15),

15. 7354623 - Surface modification of a porous organic material through the use of a supercritical fluid (2008-04-08),

Title: Yu-Liang Lin: Innovator from Hsin-Chu

Introduction: Yu-Liang Lin is a renowned inventor hailing from Hsin-Chu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Lin's latest patents focus on advancements in semiconductor technology, particularly in the development of cutting-edge microchips with enhanced processing capabilities.

Career Highlights: With a career spanning over two decades, Lin has worked with leading tech companies in Taiwan, spearheading research and development projects that have led to significant technological breakthroughs in the industry.

Collaborations: Throughout his career, Lin has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge-sharing within the tech community.

Conclusion: Yu-Liang Lin's dedication to pushing the boundaries of technology and his relentless pursuit of innovation continue to inspire the next generation of inventors and tech enthusiasts worldwide.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]