The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2018
Filed:
Dec. 21, 2016
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Inventors:
Wen-Chih Chiou, Zhunan Township, TW;
Yung-Chi Lin, Su-Lin, TW;
Yu-Liang Lin, Hsin-Chu, TW;
Hung-Jung Tu, Hualien, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/673 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6831 (2013.01); H01L 21/67383 (2013.01); H01L 21/67386 (2013.01);
Abstract
A method comprising placing a wafer assembly in a wafer cassette, wherein the wafer assembly includes a wafer and an electrostatic carrier attached to the wafer. In addition, the electrostatic carrier is charged through the wafer cassette, the wafer cassette is transported to a next process stage, and the wafer assembly is removed from the wafer cassette.