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Yung-Chi Lin

USPTO Granted Patents = 76 (Patent Applications = 5)

Average Co-Inventor Count = 4.4

ph-index = 8

Forward Citations = 1,371(Granted Patents)

Forward Citations (Not Self Cited) = 1,345(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Sun-Lin, TW (2014 - 2015)
Su-Li, TW (2016)
Hsin-Chu, TW (2017)
Taipei County, TW (2019)
Su-Lin, TW (2012 - 2024)
New Taipei, TW (2018 - 2024)

Company Filing History:

75 out of 40,780

Taiwan Semiconductor Manufacturing Comp. Ltd.

TSMC Solid State Lighting Ltd.

Years Active: 2012-2025

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Areas of Expertise:

Integrated Circuit Packages

Wafer Bonding

Semiconductor Devices

Through Silicon Vias

Interconnect Structures

3D IC Architecture

Isolation Bonding Film

Die Stack Structure

Semiconductor Manufacturing Process

Robust Through-Silicon-Via Structure

Capped Through-Substrate Via

Dummy Structure

76 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12489016 - Integrated circuit packages and methods of forming the same (2025-12-02),

2. 12374655 - Method of forming package structure by using a wafer chuck with adjustable curved surface (2025-07-29),

3. 12374651 - Wafer bonding method (2025-07-29),

4. 12322680 - Semiconductor device having backside interconnect structure on through substrate via (2025-06-03),

5. 12266612 - Method for forming a semiconductor device including forming a first interconnect structure on one side of a substrate having first metal feature closer the substrate than second metal feature and forming first and second tsv on other side of substrate connecting to the metal features (2025-04-01),

6. 12261151 - Integrated circuit packages (2025-03-25),

7. 12087732 - Isolation bonding film for semiconductor packages and methods of forming the same (2024-09-10),

8. 12015008 - Wafer bonding method (2024-06-18),

9. 11948920 - Semiconductor device and method for manufacturing the same, and semiconductor package (2024-04-02),

10. 11855067 - Integrated circuit package and method (2023-12-26),

11. 11855021 - Semiconductor structure with through substrate vias and manufacturing method thereof (2023-12-26),

12. 11854990 - Method for forming a semiconductor device having TSV formed through a silicon interposer and a second silicon substrate with cavity covering a second die (2023-12-26),

13. 11823979 - Method of forming semiconductor device having backside interconnect structure on through substrate via (2023-11-21),

14. 11756883 - Through via structure and method (2023-09-12),

15. 11728314 - Methods of forming integrated circuit packages (2023-08-15),

Title: The Innovative Journey of Yung-Chi Lin

Introduction: Yung-Chi Lin, a distinguished inventor hailing from Su-Lin, Taiwan, has made significant contributions to the field of technology and innovation.

Latest Patents: Yung-Chi Lin's latest patents focus on advancements in biotechnology, particularly in the development of novel drug delivery systems and precision medicine solutions.

Career Highlights: With a career spanning over two decades, Yung-Chi Lin has held key positions in various research institutions and pharmaceutical companies, leading groundbreaking projects that have shaped the landscape of modern medicine.

Collaborations: Yung-Chi Lin is known for his collaborative spirit, having worked closely with renowned scientists, researchers, and industry experts to bring cutting-edge technologies from the lab to the market.

Conclusion: Yung-Chi Lin's relentless pursuit of innovation and his commitment to pushing the boundaries of science continue to inspire the next generation of inventors and researchers worldwide.

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