Yung-Chi Lin

This inventor holds 85 USPTO granted patents and 35 published patent applications, primarily in Integrated Circuit Packaging (CPC class H01L). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd., TSMC Solid State Lighting Ltd.. Active years: 2012-2026.

USPTO Granted Patents = 85 (Patent Applications = 35)

% Patents Active = 94.1

Average Co-Inventor Count = 4.2

ph-index = 9

Forward Citations = 1,522(Granted Patents)

Forward Citations (Not Self Cited) = 1,345(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Sun-Lin, TW (2014 - 2015)
Su-Li, TW (2016)
Hsin-Chu, TW (2017)
Taipei County, TW (2019)
Su-Lin, TW (2012 - 2024)
New Taipei, TW (2018 - 2024)

Company Filing History:

79 out of 42,759

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

5 out of 463

Taiwan Semiconductor Manufacturing Co., Ltd.

patents

1 out of 117

TSMC Solid State Lighting Ltd.

patents

Years Active: 2012-2026

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Areas of Expertise:

Integrated Circuit Package

Wafer Bonding

Semiconductor Device

Through Substrate Via

3D IC Architecture

Interconnect Structure

Isolation Bonding Film

Backside Interconnect

Die Stack Structure

Semiconductor Structures

Three-Dimensional Chip Stacking

Manufacturing Method

85 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12727482 - Warpage modulation through implantation and the structures thereof (2026-09-01),

2. 12727415 - Stealth patterning formation for bonding improvement (2026-09-01),

3. 12713855 - SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING METHOD THEREOF (2026-08-18),

4. 12702006 - Method for singulating semiconductor devices and manufacturing a package device including the semiconductor devices (2026-08-04),

5. 12685069 - Manufacturing method of the semiconductor package, pick and place device, and workpiece handling apparatus (2026-07-14),

6. 12653039 - Semiconductor device and method of forming the same (2026-06-09),

7. 12648493 - Semiconductor device and method of manufacture (2026-06-02),

8. 12642042 - Method and apparatus for bonding semiconductor substrate (2026-05-26),

9. 12550793 - Integrated circuit package and method (2026-02-10),

10. 12489016 - Integrated circuit packages and methods of forming the same (2025-12-02),

11. 12374655 - Method of forming package structure by using a wafer chuck with adjustable curved surface (2025-07-29),

12. 12374651 - Wafer bonding method (2025-07-29),

13. 12322680 - Semiconductor device having backside interconnect structure on through substrate via (2025-06-03),

14. 12266612 - Method for forming a semiconductor device including forming a first interconnect structure on one side of a substrate having first metal feature closer the substrate than second metal feature and forming first and second tsv on other side of substrate connecting to the metal features (2025-04-01),

15. 12261151 - Integrated circuit packages (2025-03-25),

Title: The Innovative Journey of Yung-Chi Lin

Introduction: Yung-Chi Lin, a distinguished inventor hailing from Su-Lin, Taiwan, has made significant contributions to the field of technology and innovation.

Latest Patents: Yung-Chi Lin's latest patents focus on advancements in biotechnology, particularly in the development of novel drug delivery systems and precision medicine solutions.

Career Highlights: With a career spanning over two decades, Yung-Chi Lin has held key positions in various research institutions and pharmaceutical companies, leading groundbreaking projects that have shaped the landscape of modern medicine.

Collaborations: Yung-Chi Lin is known for his collaborative spirit, having worked closely with renowned scientists, researchers, and industry experts to bring cutting-edge technologies from the lab to the market.

Conclusion: Yung-Chi Lin's relentless pursuit of innovation and his commitment to pushing the boundaries of science continue to inspire the next generation of inventors and researchers worldwide.