The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2026
Filed:
Jan. 10, 2023
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Hsien-Ju Tsou, Taipei, TW;
Yung-Chi Lin, Su-Lin City, TW;
Yi-Hsiu Chen, Hsinchu, TW;
Tsang-Jiuh Wu, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
In an embodiment, a device includes an integrated circuit die including a first sidewall, a second sidewall, and a third sidewall, wherein the third sidewall of the integrated circuit die is connected to the first sidewall of the integrated circuit die and the second sidewall of the integrated circuit die, wherein the third sidewall of the integrated circuit die forms a chamfered corner of the integrated circuit die; a first dielectric surrounding the integrated circuit die; a semiconductor feature disposed over the integrated circuit die, wherein the semiconductor feature includes a first sidewall, a second sidewall, and a third sidewall, wherein the third sidewall of the semiconductor feature is connected to the first sidewall of the semiconductor feature and the second sidewall of the semiconductor feature and forms a chamfered corner of the semiconductor feature; and a second dielectric surrounding the semiconductor feature.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile