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Yi-Hsiu Chen

This inventor holds 36 USPTO granted patents and 8 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2014-2026.

USPTO Granted Patents = 36 (Patent Applications = 8)

% Patents Active = 88.9

Average Co-Inventor Count = 3.7

ph-index = 4

Forward Citations = 994(Granted Patents)

Location History:

Hsinchu, TW (2014 - 2024)
Taipei, TW (2018 - 2024)

Company Filing History:

34 out of 42,679

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

2 out of 437

Taiwan Semiconductor Manufacturing Co., Ltd.

patents

Years Active: 2014-2026

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Areas of Expertise:

Self-Aligned Patterning

Metal Gate Formation

Integrated Circuit Packages

Cavity Formation

Passivation Structure

Three-Dimensional Circuits

Chip-Staking Methods

Through-Substrate Via

Wet Etch Processes

Bond Structures

Surface Modification Treatment

Dummy Structures

36 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12702051 - Integrated circuit packages and methods (2026-08-04),

2. 12702006 - Method for singulating semiconductor devices and manufacturing a package device including the semiconductor devices (2026-08-04),

3. 12527072 - Self-aligned patterning layer for metal gate formation (2026-01-13),

4. 12506029 - Gap filling method in semiconductor manufacturing process (2025-12-23),

5. 12489016 - Integrated circuit packages and methods of forming the same (2025-12-02),

6. 12417924 - Formation of self-assembled monolayer for selective etching process (2025-09-16),

7. 12272733 - Transistor device for source/drain backside contact and method of forming cavity (2025-04-08),

8. 12218022 - Passivation structure with planar top surfaces (2025-02-04),

9. 12051672 - Package structure and method of forming the same (2024-07-30),

10. 11942527 - Forming a cavity with a wet etch for backside contact formation (2024-03-26),

11. 11817361 - Passivation structure with planar top surfaces (2023-11-14),

12. 11699694 - Method of manufacturing semiconductor package structure (2023-07-11),

13. 11688639 - Semiconductor device and method (2023-06-27),

14. 11437480 - Forming a cavity with a wet etch for backside contact formation (2022-09-06),

15. 11043481 - Method of manufacturing semiconductor package structure (2021-06-22),

Title: Yi-Hsiu Chen: Innovator from Hsinchu

Introduction: Yi-Hsiu Chen is a renowned inventor hailing from Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Chen's latest patents focus on advancements in semiconductor technology, particularly in the development of cutting-edge microchips with enhanced processing capabilities.

Career Highlights: With a career spanning over two decades, Yi-Hsiu Chen has worked with leading tech companies in Taiwan, spearheading research and development projects that have led to significant technological advancements in the industry.

Collaborations: Throughout his career, Chen has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and excellence in all his projects.

Conclusion: Yi-Hsiu Chen's dedication to innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and researchers in Taiwan and beyond.

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