The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2026
Filed:
Dec. 06, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Yu-Sheng Lin, Taichung City, TW;
Yang-Chih Hsueh, Hsinchu City, TW;
Yan-Zuo Tsai, Hsinchu City, TW;
Ming-Tsu Chung, Hsinchu, TW;
Yung-Chi Lin, New Taipei City, TW;
Yen-Ming Chen, Hsin-Chu County, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A method of bonding semiconductor chips is described. The method includes the following steps. A semiconductor wafer is provided on a chuck table of a bonding apparatus. A bond head of the bonding apparatus is driven for picking up a first semiconductor chip from a support, wherein the first semiconductor chip has a first warpage amount. The bond head is driven for moving the first semiconductor chip to a position located over a first bonding region of the semiconductor wafer. A deforming process is performed using a deforming mechanism to deform the chuck table and the first bonding region of the semiconductor wafer by a first deform amount, wherein the first deform amount corresponds to the first warpage amount. The first semiconductor chip is bonded to the first bonding region of the semiconductor wafer while maintaining the first deform amount. The deforming mechanism is released from deforming the chuck table.