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For the Inventor, By the Inventor

Hsinchu, Taiwan

Ming-Tsu Chung

USPTO Granted Patents = 20 

Average Co-Inventor Count = 6.1

ph-index = 3

Forward Citations = 17(Granted Patents)


Company Filing History:

goldMedal20 out of 40,780 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2015-2025

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20 patents (USPTO):Explore Patents
1. 12489016 - Integrated circuit packages and methods of forming the same (2025-12-02),
2. 12362315 - Heterogeneous dielectric bonding scheme (2025-07-15),
3. 12322680 - Semiconductor device having backside interconnect structure on through substrate via (2025-06-03),
4. 12087732 - Isolation bonding film for semiconductor packages and methods of forming the same (2024-09-10),
5. 12074064 - TSV structure and method forming same (2024-08-27),
6. 11869869 - Heterogeneous dielectric bonding scheme (2024-01-09),
7. 11823979 - Method of forming semiconductor device having backside interconnect structure on through substrate via (2023-11-21),
8. 11721666 - Isolation bonding film for semiconductor packages and methods of forming the same (2023-08-08),
9. 11527439 - TSV structure and method forming same (2022-12-13),
10. 11101240 - Isolation bonding film for semiconductor packages and methods of forming the same (2021-08-24),
11. 11056419 - Semiconductor device having backside interconnect structure on through substrate via and method of forming the same (2021-07-06),
12. 11004741 - Profile of through via protrusion in 3DIC interconnect (2021-05-11),
13. 10566237 - Profile of through via protrusion in 3DIC interconnect (2020-02-18),
14. 10510641 - Semiconductor device having backside interconnect structure on through substrate via and method of forming the same (2019-12-17),
15. 10163705 - Profile of through via protrusion in 3DIC interconnect (2018-12-25),

Title: The Innovative Journey of Ming-Tsu Chung

Introduction:

Ming-Tsu Chung, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations and patents.

Latest Patents:

Chung's latest patents focus on advancements in semiconductor technology, particularly in the development of cutting-edge microchips with enhanced performance and efficiency.

Career Highlights:

With a career spanning over two decades, Ming-Tsu Chung has held key roles in leading tech companies, where he spearheaded research and development projects that have resulted in numerous successful patent applications.

Collaborations:

Throughout his career, Chung has collaborated with top researchers, engineers, and scientists from around the globe, fostering a culture of innovation and excellence in the projects he has been involved in.

Conclusion:

Ming-Tsu Chung's relentless pursuit of innovation and his passion for pushing the boundaries of technology have solidified his reputation as a visionary inventor in the ever-evolving tech landscape.

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