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For the Inventor, By the Inventor

Hsinchu, Taiwan

Ming-Tsu Chung

This inventor holds 24 USPTO granted patents and 33 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2015-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ming-Tsu Chung. Retrieved from https://idiyas.com/inventor/ming-tsu-chung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24 

% Patents Active = 95.8

Average Co-Inventor Count = 5.5

ph-index = 3

Forward Citations = 25(Granted Patents)


Company Filing History:

goldMedal22 out of 42,926 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal2 out of 491 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2015-2026

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Areas of Expertise:
Semiconductor Devices
Backside Interconnect
Through Substrate Via
3DIC Interconnect
Dielectric Bonding
Isolation Bonding Film
Integrated Circuits
Conductive Structures
Warpage Modulation
Stealth Patterning
Heterogeneous Bonding
Redistribution Layer
24 patents (USPTO):Explore Patents
1. 12727482 - Warpage modulation through implantation and the structures thereof (2026-09-01),
2. 12727415 - Stealth patterning formation for bonding improvement (2026-09-01),
3. 12653039 - Semiconductor device and method of forming the same (2026-06-09),
4. 12642042 - Method and apparatus for bonding semiconductor substrate (2026-05-26),
5. 12489016 - Integrated circuit packages and methods of forming the same (2025-12-02),
6. 12362315 - Heterogeneous dielectric bonding scheme (2025-07-15),
7. 12322680 - Semiconductor device having backside interconnect structure on through substrate via (2025-06-03),
8. 12087732 - Isolation bonding film for semiconductor packages and methods of forming the same (2024-09-10),
9. 12074064 - TSV structure and method forming same (2024-08-27),
10. 11869869 - Heterogeneous dielectric bonding scheme (2024-01-09),
11. 11823979 - Method of forming semiconductor device having backside interconnect structure on through substrate via (2023-11-21),
12. 11721666 - Isolation bonding film for semiconductor packages and methods of forming the same (2023-08-08),
13. 11527439 - TSV structure and method forming same (2022-12-13),
14. 11101240 - Isolation bonding film for semiconductor packages and methods of forming the same (2021-08-24),
15. 11056419 - Semiconductor device having backside interconnect structure on through substrate via and method of forming the same (2021-07-06),

Title: The Innovative Journey of Ming-Tsu Chung

Introduction:

Ming-Tsu Chung, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations and patents.

Latest Patents:

Chung's latest patents focus on advancements in semiconductor technology, particularly in the development of cutting-edge microchips with enhanced performance and efficiency.

Career Highlights:

With a career spanning over two decades, Ming-Tsu Chung has held key roles in leading tech companies, where he spearheaded research and development projects that have resulted in numerous successful patent applications.

Collaborations:

Throughout his career, Chung has collaborated with top researchers, engineers, and scientists from around the globe, fostering a culture of innovation and excellence in the projects he has been involved in.

Conclusion:

Ming-Tsu Chung's relentless pursuit of innovation and his passion for pushing the boundaries of technology have solidified his reputation as a visionary inventor in the ever-evolving tech landscape.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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