Company Filing History:
Years Active: 2019-2024
Title: Yan-Zuo Tsai: Innovator in Semiconductor Technology
Introduction
Yan-Zuo Tsai is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of four patents. His work focuses on innovative methods and devices that enhance semiconductor manufacturing processes.
Latest Patents
Among his latest patents is a semiconductor device and method for manufacturing the same, which includes a semiconductor package. This invention features a die stack comprising a first die, second dies stacked on the first die, and a third die stacked on the second dies. The first die includes first through semiconductor vias, while the second and third dies include their respective through semiconductor vias. The cap substrate is positioned on the third die, with a combined thickness of the third die and cap substrate ranging from about 50 μm to about 80 μm. Another notable patent is a method and apparatus for bonding semiconductor devices. This method involves attaching a first die to a flip head of a flip module, flipping the die, and ensuring cleanliness of the flip head before attaching a second die.
Career Highlights
Yan-Zuo Tsai is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise and innovative approach have positioned him as a key player in advancing semiconductor technologies.
Collaborations
He has collaborated with notable colleagues such as Yang-Chih Hsueh and Chia-Yin Chen, contributing to various projects that push the boundaries of semiconductor innovation.
Conclusion
Yan-Zuo Tsai's work in semiconductor technology exemplifies the spirit of innovation and dedication to advancing manufacturing processes. His patents reflect a commitment to improving the efficiency and effectiveness of semiconductor devices.