The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2017
Filed:
Jul. 18, 2016
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Shin-Puu Jeng, Hsin-Chu, TW;
Wen-Chih Chiou, Zhunan Township, TW;
Tu-Hao Yu, Hsin-Chu, TW;
Hung-Jung Tu, Hualien, TW;
Yu-Liang Lin, Hsin-Chu, TW;
Shih-Hui Wang, Zhonghe, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
Packaged semiconductor devices are disclosed. In some embodiments, a packaged semiconductor device includes a substrate and a plurality of integrated circuit dies coupled to the substrate. The device also includes a molding material disposed over the substrate between adjacent ones of the plurality of integrated circuit dies. A cap layer is disposed over the molding material and the plurality of integrated circuit dies, wherein the cap layer comprises an electrically conductive material that directly contacts the molding material and each of the plurality of integrated circuit dies.