Shih-Hui Wang

Title: Innovator Spotlight: Shih-Hui Wang

Introduction

Shih-Hui Wang is an accomplished inventor based in Zhonghe, Taiwan, known for his significant contributions to semiconductor technology. With a commendable portfolio of eight patents, he has made noteworthy advancements in the field, particularly through innovative package structures that enhance semiconductor device reliability and performance.

Latest Patents

Among his recent innovations, Wang's latest patents detail two distinct package structures. The first patent introduces a package structure comprising a semiconductor device and an adhesive pattern. This design features an adhesive pattern that surrounds the semiconductor device, creating an angle θ between the sidewall of the semiconductor device and the sidewall of the adhesive pattern, constrained within the range of 0°<θ<90°. Notably, the adhesive layer includes a first opening that is misaligned with the corner of the semiconductor device closest to this opening.

The second patent presents another package structure that incorporates a substrate, a semiconductor device, and an adhesive layer. In this design, the semiconductor device is positioned on the substrate, forming an angle θ between one sidewall of the semiconductor device and one side of the substrate, also abiding by the constraint of 0°<θ<90°. The adhesive layer envelops the semiconductor device upon the substrate and is continuously applied along two sides of the substrate. Similar to the first patent, the adhesive layer has a first opening misaligned with the corner of the semiconductor device closest to it.

Career Highlights

Shih-Hui Wang serves as a key inventor at Taiwan Semiconductor Manufacturing Company Limited (TSMC), a leading global semiconductor foundry known for its cutting-edge technologies and exceptional manufacturing capabilities. Throughout his career, Wang has focused on driving innovations that boost semiconductor efficiency while addressing challenges in device packaging and thermal management.

Collaborations

Wang collaborates with esteemed colleagues such as Wen-Chih Chiou and Shin-Puu Jeng, who contribute their expertise to bolster their collective efforts in semiconductor research and development. These collaborations help foster an environment of innovation and technological progression within TSMC.

Conclusion

With his impressive array of patents and continuous contributions to the semiconductor field, Shih-Hui Wang exemplifies the spirit of innovation that drives advancements in technology. His work not only enhances the functionality of semiconductor devices but also paves the way for future breakthroughs in the field.