Taiwan Semiconductor Manufacturing Comp. Ltd.

Shih-Hui Wang

Wen-Chih Chiou

Shin-Puu Jeng

Der-Chyang Yeh

Tsung-Shu Lin

Shih-Peng Tai

Yi-Chung Huang

Chen-Hua Douglas Yu

Jing-Cheng Lin

Weng-Jin Wu

Yu-Liang Lin

Hung-Jung Tu

Tu-Hao Yu

Fang Wen Tsai

Chen-Yu Tsai

Chia-Ho Chen

Chien-Ming Chiu

Yung-Chi Lin

Chih-Hung Cheng

A package structure includes a semiconductor device and an adhesive pattern. The adhesive pattern surrounds the semiconductor device, wherein an angle θ is formed between a sidewall of the semiconductor device and a sidewall of the adhesive pattern, 0°<θ<90° wherein the adhesive layer has a first opening misaligned with a corner of the semiconductor device closest to the first opening.

Package structure

A package structure includes a substrate, a semiconductor device and an adhesive layer. The semiconductor device is disposed on the substrate, wherein an angle &#x3b8; is formed between one sidewall of the semiconductor device and one of sides of the substrate, 0&#xb0;&#x3c;&#x3b8;&#x3c;90&#xb0;. The adhesive layer surrounds the semiconductor device on the substrate and at least continuously disposed at two of the sides of the substrate, wherein the adhesive layer has a first opening misaligned with a corner of the semiconductor device closest to the first opening.

A package structure including a substrate, a semiconductor device, a heat spreader, and an adhesive layer is provided. The semiconductor device is bonded onto the substrate, wherein an angle &#x3b8; is formed between one sidewall of the semiconductor device and one sidewall of the substrate, 0&#xb0;&#x3c;&#x3b8;&#x3c;90&#xb0;. The heat spreader is disposed over the substrate, wherein the semiconductor device is disposed between the heat spreader and the substrate. The adhesive layer is surrounding the semiconductor device and attaching the heat spreader onto the substrate, wherein the adhesive layer has a first opening misaligned with one of corners of the semiconductor device closest to the first opening.

Package structure and manufacturing method thereof

A package carrier includes a carrier and a light absorption layer. The light absorption layer is disposed on the carrier. The light absorption layer includes a notch at the periphery of the carrier, and the notch is light transmissive so as to expose the carrier to light in a normal direction of the carrier. A semiconductor manufacturing process is also provided.

Semiconductor manufacturing process and package carrier

Packaged semiconductor devices are disclosed. In some embodiments, a packaged semiconductor device includes a substrate and a plurality of integrated circuit dies coupled to the substrate. The device also includes a molding material disposed over the substrate between adjacent ones of the plurality of integrated circuit dies. A cap layer is disposed over the molding material and the plurality of integrated circuit dies, wherein the cap layer comprises an electrically conductive material that directly contacts the molding material and each of the plurality of integrated circuit dies.

Methods of packaging semiconductor devices and packaged semiconductor devices

In accordance with an embodiment, a structure comprises a substrate having a first area and a second area; a through substrate via (TSV) in the substrate penetrating the first area of the substrate; an isolation layer over the second area of the substrate, the isolation layer having a recess; and a conductive material in the recess of the isolation layer, the isolation layer being disposed between the conductive material and the substrate in the recess.

Alignment mark and method of formation

Methods of packaging semiconductor devices and packaged semiconductor devices are disclosed. In some embodiments, a method of packaging semiconductor devices includes coupling integrated circuit dies to a substrate, and disposing a molding material around the integrated circuit dies. A cap layer is disposed over the molding material and the plurality of integrated circuit dies.

Growing community of inventors

Zhonghe, Taiwan

Shih-Hui Wang