The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2012
Filed:
May. 07, 2009
Applicants:
Yu-liang Lin, Hsin-Chu, TW;
Chien Ling Hwang, Hsin Chu, TW;
Jean Wang, Hsin Chu, TW;
Chen-hua Yu, Hsin-Chu, TW;
Inventors:
Yu-Liang Lin, Hsin-Chu, TW;
Chien Ling Hwang, Hsin Chu, TW;
Jean Wang, Hsin Chu, TW;
Chen-Hua Yu, Hsin-Chu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 7/22 (2006.01); B24B 57/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A chemical mechanical polishing (CMP) device for processing a wafer is provided which includes a plate for supporting the wafer to be processed in a face-up orientation, a polishing head opposing the plate, wherein the polishing head includes a rotatable polishing pad operable to contact the wafer while the polishing pad is rotating, and a slurry coating system providing a slurry to the polishing pad for polishing the wafer.