The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2022

Filed:

Jun. 18, 2019
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Wen-Chih Chiou, Zhunan Township, TW;

Yu-Liang Lin, Hsinchu, TW;

Hung-Jung Tu, Hualien, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 21/02057 (2013.01); H01L 21/67092 (2013.01); H01L 21/67173 (2013.01); H01L 21/67207 (2013.01); H01L 2221/68381 (2013.01); Y10T 156/11 (2015.01); Y10T 156/19 (2015.01);
Abstract

The present disclosure, in some embodiments, relates to a debonding and cleaning apparatus. The apparatus has a debonding module configured to separate semiconductor substrates from carrier substrates. A first cleaning module is configured to clean surfaces of a first plurality of the semiconductor substrates and a second cleaning module is configured to clean surfaces of a second plurality of the semiconductor substrates. The apparatus also has a first substrate handling module including a first robotic arm in communication with the debonding module and a second substrate handling module including a second robotic arm that is located between the first cleaning module and the second cleaning module. The second substrate handling module is configured to transfer the first plurality of the semiconductor substrates to first cleaning module and to transfer the second plurality of the semiconductor substrates to the second cleaning module.


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