The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2015
Filed:
May. 17, 2013
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Tu-Hao Yu, Hsin-Chu, TW;
Wen-Chih Chiou, Miaoli, TW;
Hung-Jung Tu, Hualien, TW;
Yu-Liang Lin, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
Embodiments of the present disclosure include methods of forming a semiconductor device. An embodiment is a method for forming a semiconductor device, the method including applying a substrate to a carrier with an adhesive layer between the carrier and the substrate, curing a portion of the adhesive layer, the cured portion surrounding an uncured portion of the adhesive layer, removing the carrier from adhesive layer, removing the uncured portion of the adhesive layer, and removing the cured portion of the adhesive layer.