The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2014
Filed:
Apr. 11, 2011
Weng-jin Wu, Hsin-Chu, TW;
Hung-jung Tu, Hualien, TW;
Ku-feng Yang, Dali, TW;
Jung-chih HU, Yangmei Township, TW;
Wen-chih Chiou, Miaoli, TW;
Weng-Jin Wu, Hsin-Chu, TW;
Hung-Jung Tu, Hualien, TW;
Ku-Feng Yang, Dali, TW;
Jung-Chih Hu, Yangmei Township, TW;
Wen-Chih Chiou, Miaoli, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A method of forming integrated circuits includes laminating a patterned film including an opening onto a wafer, wherein a bottom die in the wafer is exposed through the opening. A top die is placed into the opening. The top die fits into the opening with substantially no gap between the patterned film and the top die. The top die is then bonded onto the bottom die, followed by curing the patterned film.