The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2014
Filed:
Jul. 30, 2012
Ching-yu Lo, Hsin-Chu, TW;
Hung-jung Tu, Hualien, TW;
Hai-ching Chen, Hsin-Chu, TW;
Tien-i Bao, Dayuan Township, TW;
Wen-chih Chiou, Miaoli, TW;
Chen-hua Yu, Hsin-Chu, TW;
Ching-Yu Lo, Hsin-Chu, TW;
Hung-Jung Tu, Hualien, TW;
Hai-Ching Chen, Hsin-Chu, TW;
Tien-I Bao, Dayuan Township, TW;
Wen-Chih Chiou, Miaoli, TW;
Chen-Hua Yu, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
An integrated circuit structure includes a semiconductor substrate; a through-semiconductor via (TSV) opening extending into the semiconductor substrate; and a TSV liner in the TSV opening. The TSV liner includes a sidewall portion on a sidewall of the TSV opening and a bottom portion at a bottom of the TSV opening. The bottom portion of the TSV liner has a bottom height greater than a middle thickness of the sidewall portion of the TSV liner.