Company Filing History:
Years Active: 2012-2014
Title: Innovations of Ching-Yu Lo
Introduction
Ching-Yu Lo is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on enhancing the performance and reliability of integrated circuit devices.
Latest Patents
One of his latest patents is titled "Interconnect with flexible dielectric layer." This invention describes an integrated circuit device featuring a dual damascene structure that includes a lower via portion formed in a polyimide layer and an upper line portion formed in an inter-metal dielectric (IMD) layer made of either undoped silicate glass (USG) or polyimide. A passivation layer is applied on the IMD layer, with a bond pad positioned over the passivation layer to ensure electrical connectivity of the upper line portion. Another notable patent is "High mechanical strength additives for porous ultra low-k material." This patent discloses a semiconductor device and method that enhances mechanical strength. The device comprises a semiconductor substrate, an adhesion layer over the substrate, and a porous low-k film that includes a porogen and a composite bonding structure featuring at least one Si—O—Si bonding group and at least one bridging organic functional group.
Career Highlights
Ching-Yu Lo is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His innovative work has positioned him as a key player in advancing semiconductor technologies.
Collaborations
Throughout his career, Ching-Yu has collaborated with notable colleagues, including Hai-Ching Chen and Tien-I Bao. These partnerships have fostered a collaborative environment that enhances innovation and development in their projects.
Conclusion
Ching-Yu Lo's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to pave the way for advancements in integrated circuit devices and materials.