The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2013
Filed:
Apr. 02, 2012
Applicants:
Chen-hua Yu, Hsin-Chu, TW;
Wen-chih Chiou, Miaoli, TW;
Weng-jin Wu, Hsin-Chu, TW;
Hung-jung Tu, Hualien, TW;
Ku-feng Yang, Dali, TW;
Inventors:
Chen-Hua Yu, Hsin-Chu, TW;
Wen-Chih Chiou, Miaoli, TW;
Weng-Jin Wu, Hsin-Chu, TW;
Hung-Jung Tu, Hualien, TW;
Ku-Feng Yang, Dali, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor structure includes a first die comprising a first substrate and a first bonding pad over the first substrate, a second die having a first surface and a second surface opposite the first surface, wherein the second die is stacked on the first die and a protection layer having a vertical portion on a sidewall of the second die, and a horizontal portion extending over the first die.