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Hsin-Ping Chen

This inventor holds 42 USPTO granted patents and 25 published patent applications, primarily in Semiconductor Technology. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2017-2026.

USPTO Granted Patents = 42 (Patent Applications = 25)

% Patents Active = 97.6

Average Co-Inventor Count = 4.9

ph-index = 3

Forward Citations = 49(Granted Patents)

Location History:

Hsinchu County, TW (2017 - 2024)
Hsinchu, TW (2019 - 2024)

Company Filing History:

42 out of 42,679

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2017-2026

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Areas of Expertise:

Interconnect Structure

Gate-All-Around Device

Heat Dissipation

Hybrid Metal Lines

Self-Aligned Vias

NEMS Device

Air Gaps

Metal Layer Structures

Vertical MOS Transistor

Deep Metal Lines

Integrated Circuit

Spacers

42 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12701982 - Semiconductor structure and manufacturing method thereof (2026-08-04),

2. 12701932 - Semiconductor device structure and manufacturing method thereof (2026-08-04),

3. 12635496 - Semiconductor device including interconnects with lower contact resistance (2026-05-19),

4. 12628630 - Interconnect structure with reinforcing spacer and method for manufacturing the same (2026-05-12),

5. 12575397 - Metal lines of hybrid heights (2026-03-10),

6. 12543556 - Semiconductor devices and methods of forming the same (2026-02-03),

7. 12412804 - Semiconductor structure with improved heat dissipation (2025-09-09),

8. 12230534 - Semiconductor device and method of manufacture (2025-02-18),

9. 12183671 - Hybrid metal line structure (2024-12-31),

10. 12136567 - Fully self-aligned interconnect structure (2024-11-05),

11. 12094946 - Gate all around device (2024-09-17),

12. 12094816 - Semiconductor structure having deep metal line and method for forming the semiconductor structure (2024-09-17),

13. 12080593 - Barrier-less structures (2024-09-03),

14. 12062611 - Integrated circuit interconnect structures with air gaps (2024-08-13),

15. 11984359 - Semiconductor device with spacers for self aligned vias (2024-05-14),

Title: The Innovative Journey of Hsin-Ping Chen

Introduction:

Hsin-Ping Chen, a distinguished inventor hailing from Hsinchu County, Taiwan, has made significant contributions to the field of technology and innovation through his groundbreaking inventions.

Latest Patents:

Hsin-Ping Chen's latest patents include cutting-edge technologies in the fields of artificial intelligence, renewable energy, and biotechnology, showcasing his versatility and forward-thinking approach to innovation.

Career Highlights:

Throughout his illustrious career, Hsin-Ping Chen has been recognized for his pioneering work in developing sustainable solutions for global challenges. His inventions have not only revolutionized industries but have also positively impacted the lives of people worldwide.

Collaborations:

Hsin-Ping Chen has collaborated with leading research institutions, universities, and multinational companies to further advance his inventions and bring them to the market. His collaborative efforts have resulted in the successful implementation of innovative technologies across various sectors.

Conclusion:

In conclusion, Hsin-Ping Chen's dedication to innovation, coupled with his passion for creating a sustainable future, has solidified his position as a visionary inventor. His relentless pursuit of excellence continues to inspire the next generation of inventors and innovators worldwide.

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