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For the Inventor, By the Inventor

Tokyo, Japan

Hirokazu Ezawa

This inventor holds 36 USPTO granted patents and 3 published patent applications, primarily in Semiconductor Manufacturing. Top assignees: Kabushiki Kaisha Toshiba, Ebara Corporation, Other. Active years: 1991-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hirokazu Ezawa. Retrieved from https://idiyas.com/inventor/hirokazu-ezawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 36 

% Patents Active = 88.9

Average Co-Inventor Count = 3.3

ph-index = 13

Forward Citations = 576(Granted Patents)


Location History:

  • Tokyo-To, JP (2004)
  • Oota Tokyo, JP (2016)
  • Tokyo, JP (1991 - 2017)

Company Filing History:

goldMedal34 out of 53,250 
 
Kabushiki Kaisha Toshiba
 patents
silverMedal4 out of 2,573 
 
Ebara Corporation
 patents
bronzeMedal1 out of 834,453 
Other
 patents
where one patent can have more than one assignee

Years Active: 1991-2017

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Areas of Expertise:
Semiconductor Device
Bump Structure
Redistribution Layers
Manufacturing Method
Electronic Component
Protruding Bump Electrode
Thermal Management
Integrated Circuit
Copper Pad
Damage Layers
Multi-Profile Bumps
Tapered Sidewalls
36 patents (USPTO):Explore Patents
1. 9673147 - Semiconductor device and manufacturing method thereof (2017-06-06),
2. 9396998 - Semiconductor device having fan-in and fan-out redistribution layers (2016-07-19),
3. 9287225 - Semiconductor device and manufacturing method thereof (2016-03-15),
4. 9190373 - Bump structure with underbump metallization structure and integrated redistribution layer (2015-11-17),
5. 8704367 - Semiconductor device and manufacturing method of semiconductor device (2014-04-22),
6. 8703600 - Electronic component and method of connecting with multi-profile bumps (2014-04-22),
7. 8569181 - Manufacturing method of semiconductor apparatus and semiconductor apparatus (2013-10-29),
8. 8314491 - Manufacturing method of semiconductor device and semiconductor device (2012-11-20),
9. 8232197 - Method of manufacturing a semiconductor device from which damage layers and native oxide films in connection holes have been removed (2012-07-31),
10. 8063487 - Manufacturing method of semiconductor apparatus and semiconductor apparatus (2011-11-22),
11. 7638439 - Peripheral processing method and method of manufacturing a semiconductor device (2009-12-29),
12. 7605076 - Method of manufacturing a semiconductor device from which damage layers and native oxide films in connection holes have been removed (2009-10-20),
13. 7531876 - Semiconductor device having power semiconductor elements (2009-05-12),
14. 7473628 - Method of manufacturing semiconductor device and semiconductor device (2009-01-06),
15. 7399706 - Manufacturing method of semiconductor device (2008-07-15),

Title: The Innovative Mind of Hirokazu Ezawa

Introduction: Hirokazu Ezawa is a renowned inventor hailing from Tokyo, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Hirokazu Ezawa holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his diverse range of expertise and forward-thinking approach to problem-solving.

Career Highlights: With a career spanning over two decades, Hirokazu Ezawa has worked with leading tech companies in Japan, spearheading research and development projects that have led to significant advancements in various industries. His innovative solutions have revolutionized the way we interact with technology on a daily basis.

Collaborations: Throughout his career, Hirokazu Ezawa has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge-sharing. His collaborative efforts have resulted in the creation of cutting-edge technologies that have had a lasting impact on society.

Conclusion: Hirokazu Ezawa's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a visionary inventor in the tech world. His contributions continue to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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