The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2014
Filed:
Sep. 02, 2011
Tatsuo Migita, Oita, JP;
Hirokazu Ezawa, Tokyo, JP;
Soichi Yamashita, Kanagawa, JP;
Koro Nagamine, Oita, JP;
Masahiro Miyata, Oita, JP;
Tatsuo Shiotsuki, Oita, JP;
Kiyoshi Muranishi, Oita, JP;
Tatsuo Migita, Oita, JP;
Hirokazu Ezawa, Tokyo, JP;
Soichi Yamashita, Kanagawa, JP;
Koro Nagamine, Oita, JP;
Masahiro Miyata, Oita, JP;
Tatsuo Shiotsuki, Oita, JP;
Kiyoshi Muranishi, Oita, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
According to one embodiment, a semiconductor substrate, a metal film, a surface modifying layer, and a redistribution trace are provided. On the semiconductor substrate, a wire and a pad electrode are formed. The metal film is formed over the semiconductor substrate. The surface modifying layer is formed on a surface layer of the metal film and improves the adhesion with a resist pattern. The redistribution trace is formed on the metal film via the surface modifying layer.