The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2016
Filed:
Sep. 05, 2014
Kabushiki Kaisha Toshiba, Minato-ku, Tokyo, JP;
Yoichiro Kurita, Minato Tokyo, JP;
Hirokazu Ezawa, Oota Tokyo, JP;
Kazushige Kawasaki, Yokohama Kanagawa, JP;
Satoshi Tsukiyama, Yokohama Kanagawa, JP;
KABUSHIKI KAISHA TOSHIBA, Tokyo, JP;
Abstract
According to one embodiment, the first resin layer is provided on the first face of the upper layer chip. The first interconnect layer is electrically connected to the upper layer chip. The second resin layer extends into a region outside chip. The region is outer side of a side face of the upper layer chip. The second interconnect layer is provided in the second resin layer. The second interconnect layer is connected to the first interconnect layer and extending into the region outside chip. The lower layer chip is mounted on the surface side of the first resin layer, and is connected to the first interconnect layer. The first sealing resin covers the upper layer chip.