The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2012
Filed:
Jul. 29, 2010
Soichi Yamashita, Kanagawa, JP;
Tatsuo Migita, Kanagawa, JP;
Tadashi Iijima, Oita, JP;
Masahiro Miyata, Oita, JP;
Masayuki Uchida, Kanagawa, JP;
Takashi Togasaki, Kanagawa, JP;
Hirokazu Ezawa, Tokyo, JP;
Soichi Yamashita, Kanagawa, JP;
Tatsuo Migita, Kanagawa, JP;
Tadashi Iijima, Oita, JP;
Masahiro Miyata, Oita, JP;
Masayuki Uchida, Kanagawa, JP;
Takashi Togasaki, Kanagawa, JP;
Hirokazu Ezawa, Tokyo, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
According to one embodiment, a manufacturing method of a semiconductor device attained as follows. A dielectric layer having a first opening and a second opening reaching an electrode terminal is formed by modifying a photosensitive resin film on a substrate on which the electrode terminal of a first conductive layer is provided. Next, a second conductive layer that is electrically connected to the electrode terminal is formed on the dielectric layer that includes inside of the first opening, and a third conductive layer that has an oxidation-reduction potential of which difference from the oxidation-reduction potential of the first conductive layer is smaller than a difference of the oxidation-reduction potential between the first conductive layer and the second conductive layer is formed on the second conductive layer. Next, a dielectric layer having a third opening reaching the third conductive layer and a fourth opening reaching the electrode terminal via the second opening is formed by modifying a photosensitive resin film, and a bump that is electrically connected to the third conductive layer is formed.