The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2014
Filed:
Mar. 11, 2010
Tatsuo Migita, Kanagawa, JP;
Hirokazu Ezawa, Tokyo, JP;
Soichi Yamashita, Kanagawa, JP;
Takashi Togasaki, Kanagawa, JP;
Tatsuo Migita, Kanagawa, JP;
Hirokazu Ezawa, Tokyo, JP;
Soichi Yamashita, Kanagawa, JP;
Takashi Togasaki, Kanagawa, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
An electronic component in which an element is formed on a chip includes: a pad that is made of a conductive material and that is formed in a first bump formation region that is two-dimensionally arranged in center of one principle face and in a second bump formation region that is linearly arranged at peripheral border of the principle face; a passivation film that is formed on the principle face to cover portion except a formation position of the pad; a metal layer that is formed on the pad; and a bump that is made of a conductive material and that is formed on the metal layer by plating, wherein radius of the metal layer in the second bump formation region is smaller than radius of at least some of the metal layer in the first bump formation region.