IDiyas

For the Inventor, By the Inventor

Tsukuba, Japan

Hideki Takagi

USPTO Granted Patents = 17


Average Co-Inventor Count = 5.0

ph-index = 6

Forward Citations = 154(Granted Patents)


Location History:

  • Ibaraki, JP (2015 - 2019)
  • Tsukuba, JP (1995 - 2024)

Company Filing History:

goldMedal14 out of 1,710 
 
National Institute of Advanced Industrial Science and Technology
 patents
silverMedal3 out of 4,618 
 
Mitsubishi Heavy Industries Limited
 patents
bronzeMedal2 out of 9 
 
Marubun Corporation
 patents
4. 2 out of 746 
 
Toshiba Kikai Kabushiki Kaisha
 patents
5. 2 out of 851 
 
Riken Corporation
 patents
6. 2 out of 441 
 
Ulvac, Inc.
 patents
7. 2 out of 51 
 
Mitsubishi Heavy Industries Machine Tool Co., Ltd.
 patents
8. 1 out of 31 
 
Agency of Industrial Science & Technology, Ministry of International Trade & Industry
 patents
9. 1 out of 158 
 
Fujitsu Media Devices Limited
 patents
10. 1 out of 39,228 
 
Fujitsu Corporation
 patents
11. 1 out of 715 
 
L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des
 patents
12. 1 out of 1,233 
 
Tokyo Ohka Kogyo Co., Ltd.
 patents
13. 1 out of 1,812 
 
Kabushiki Kaisha Toyota Jidoshokki
 patents
14. 1 out of 5 
 
Sicoxs Corporation
 patents
15. 1 out of 6,892 
 
Sumitomo Chemical Company, Limited
 patents
16. 1 out of 1,278 
 
The University of Tokyo
 patents
where one patent can have more than one assignee

Years Active: 1995-2025

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17 patents (USPTO):
1. 12389520 - Plasma source, and atomic clock employing plasma source (2025-08-12),
2. 12027440 - Composite having diamond crystal base (2024-07-02),
3. 10189203 - Method for forming micropattern of polyimide using imprinting (2019-01-29),
4. 10112376 - Device manufactured by room-temperature bonding, device manufacturing method, and room-temperature bonding apparatus (2018-10-30),
5. 9929311 - Semiconductor light emitting element and method for producing the same (2018-03-27),
6. 9761479 - Manufacturing method for semiconductor substrate (2017-09-12),
7. 9751754 - Package formation method and MEMS package (2017-09-05),
8. 9580306 - Room temperature bonding apparatus and room temperature bonding method (2017-02-28),
9. 9349918 - Light emitting element and method for manufacturing same (2016-05-24),
10. 9112035 - Semiconductor substrate, field-effect transistor, integrated circuit, and method for fabricating semiconductor substrate (2015-08-18),
11. 8936998 - Manufcaturing method for room-temperature substrate bonding (2015-01-20),
12. 8608048 - Room-temperature bonding method and room-temperature bonding apparatus including sputtering (2013-12-17),
13. 8602289 - Room temperature bonding using sputtering (2013-12-10),
14. 8099982 - Method of molding glass parts and molding apparatus (2012-01-24),
15. 7331092 - Method and manufacturing surface acoustic wave device (2008-02-19),
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