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Hideki Takagi

USPTO Granted Patents = 17

CIPO Patents = 4

Average Co-Inventor Count = 5.0

ph-index = 6

Forward Citations = 155(Granted Patents)

Location History:

Ibaraki, JP (2015 - 2019)
Tsukuba, JP (1995 - 2024)

Company Filing History:

14 out of 1,714

National Institute of Advanced Industrial Science and Technology

Mitsubishi Heavy Industries Limited

Marubun Corporation

4. 2 out of 746

Toshiba Kikai Kabushiki Kaisha

5. 2 out of 854

Riken Corporation

6. 2 out of 441

Mitsubishi Heavy Industries Machine Tool Co., Ltd.

Agency of Industrial Science & Technology, Ministry of International Trade & Industry

9. 1 out of 158

Fujitsu Media Devices Limited

10. 1 out of 39,238

Fujitsu Corporation

11. 1 out of 715

L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des

12. 1 out of 1,234

Tokyo Ohka Kogyo Co., Ltd.

13. 1 out of 1,816

Kabushiki Kaisha Toyota Jidoshokki

Sicoxs Corporation

15. 1 out of 6,894

Sumitomo Chemical Company, Limited

16. 1 out of 1,285

The University of Tokyo

where one patent can have more than one assignee

Years Active: 1995-2025

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17 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12389520 - Plasma source, and atomic clock employing plasma source (2025-08-12),

2. 12027440 - Composite having diamond crystal base (2024-07-02),

3. 10189203 - Method for forming micropattern of polyimide using imprinting (2019-01-29),

4. 10112376 - Device manufactured by room-temperature bonding, device manufacturing method, and room-temperature bonding apparatus (2018-10-30),

5. 9929311 - Semiconductor light emitting element and method for producing the same (2018-03-27),

6. 9761479 - Manufacturing method for semiconductor substrate (2017-09-12),

7. 9751754 - Package formation method and MEMS package (2017-09-05),

8. 9580306 - Room temperature bonding apparatus and room temperature bonding method (2017-02-28),

9. 9349918 - Light emitting element and method for manufacturing same (2016-05-24),

10. 9112035 - Semiconductor substrate, field-effect transistor, integrated circuit, and method for fabricating semiconductor substrate (2015-08-18),

11. 8936998 - Manufcaturing method for room-temperature substrate bonding (2015-01-20),

12. 8608048 - Room-temperature bonding method and room-temperature bonding apparatus including sputtering (2013-12-17),

13. 8602289 - Room temperature bonding using sputtering (2013-12-10),

14. 8099982 - Method of molding glass parts and molding apparatus (2012-01-24),

15. 7331092 - Method and manufacturing surface acoustic wave device (2008-02-19),

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