The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2017
Filed:
Sep. 25, 2013
Mitsubishi Heavy Industries Machine Tool Co., Ltd., Ritto-shi, Shiga, JP;
National Institute of Advanced Industrial Science and Technology, Tokyo, JP;
Masato Kinouchi, Tokyo, JP;
Takayuki Goto, Tokyo, JP;
Takeshi Tsuno, Tokyo, JP;
Jun Utsumi, Tokyo, JP;
Kensuke Ide, Tokyo, JP;
Takenori Suzuki, Tokyo, JP;
Keiichiro Tsutsumi, Tokyo, JP;
Hideki Takagi, Ibaraki, JP;
Yuuichi Kurashima, Ibaraki, JP;
Abstract
A room temperature bonding apparatus includes a first beam source, a second beam source, and a press bonding mechanism. The first beam source emits a first activation beam that irradiates a first surface of a first substrate. Independently from the first beam source, the second beam source emits a second activation beam that irradiates a second surface of a second substrate. The press bonding mechanism bonds between the first substrate and the second substrate by contacting between the first surface and the second surface after the first surface is irradiated with the first activation beam and the second surface is irradiated with the second activation beam. Thus, a plurality of the substrates made of different materials is appropriately bonded.